LinkedIn·Wednesday, 19 August 2026·7d ago
Thank you to everyone who attended and engaged with KLA Fellow Chet Lenox and other industry leaders at last week's International…
KLA
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Thank you to everyone who attended and engaged with KLA Fellow Chet Lenox and other industry leaders at last week's International Microelectronics Assembly and Packaging Society (IMAPS) Symposium.
The discussions highlighted the opportunities and challenges shaping the future of advanced packaging and semiconductor innovation.
To learn more about KLA's work in advanced packaging, visit:
https://bit.ly/4gjtaWW
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