Overview
ZeptoNova offers deep-tech engineering services for MEMS, microfabrication, PCB design, and FPGA development. The company operates from Leuven, Belgium, supporting projects from concept through to production.
Key people
In the news
- We are hiring! https://lnkd.in/eEx3Qfhn
- ZeptoNova will be present in the 2026 edition of IEEE IUS in Raleigh, North Carolina! Rui Amendoeira Esteves will be attending and presenting his work during the following week, drop us a message to connect in Raleigh and to know more about our ultrasound capabilities.
- 𝗖𝗮𝗻 𝗢𝗽𝗲𝗻𝗔𝗜'𝘀 𝗔𝘀𝘁𝗿𝗮 𝗺𝗼𝗱𝗲𝗹 𝗱𝗲𝘀𝗶𝗴𝗻 𝗠𝗘𝗠𝗦? OpenAI's Astra model made big waves last week, with an impressive announcement video boasting incredible computer control and claiming to be the closest thing to AGI. So we decided to put to test: could Astra (Max) take a MEMS micro mirror specification as prompt and achieve a working device in Quanscient using their SDK and free computer use? And who would win? OpenAI Astra or ZeptoNova's MAIA using an open-weights model? The results are below. A bigger model
- We’re excited to welcome 𝗗𝗿. Ruben Van den Eeckhoudt to ZeptoNova! 🎉 With a PhD degree from KU Leuven, Ruben brings strong expertise in microfabrication, microfluidics, MEMS, sensor development, and cleanroom technologies, together with extensive hands-on experience in advanced micro-manufacturing. His experience ranges from precision microfluidic fabrication and high-resolution 3D printing with Nanoscribe, to surface characterization, Micro-Manufacturing, and advance packaging. We’re very happy to have Ruben on board and look
- 𝗧𝗼𝗱𝗮𝘆, 𝘄𝗲’𝗿𝗲 𝗶𝗻𝘁𝗿𝗼𝗱𝘂𝗰𝗶𝗻𝗴 𝗠𝗔𝗜𝗔 - 𝗼𝘂𝗿 𝗮𝘂𝘁𝗼𝗻𝗼𝗺𝗼𝘂𝘀 𝗠𝗘𝗠𝗦 𝗱𝗲𝘀𝗶𝗴𝗻 𝗔𝗜 𝗔𝗴𝗲𝗻𝘁. ZeptoNova has been working to rethink how MEMS devices are designed. We believe AI agents are only as capable as the knowledge they are grounded in and the tools they can use. So we started with a simple question: Why sit on years of valuable MEMS design knowledge composed by documented examples and engineering workflows? Instead, we used that invaluable data to build MAIA. MEMS design is an especially
- What if the next major performance gain does not come from the chip itself, but from how we integrate the system around it? As electronics, MEMS and photonics continue to shrink, 𝗦𝘆𝘀𝘁𝗲𝗺-𝗶𝗻-𝗣𝗮𝗰𝗸𝗮𝗴𝗲 (𝗦𝗶𝗣) 𝗶𝘀 𝗯𝗲𝗰𝗼𝗺𝗶𝗻𝗴 𝗮𝘀 𝗶𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗮𝘀 𝗰𝗵𝗶𝗽 𝗱𝗲𝘀𝗶𝗴𝗻 𝗶𝘁𝘀𝗲𝗹𝗳. Recently at ZeptoNova, we have received several requests to develop dedicated ASICs for MEMS devices, considering monolithic or 3D integration. But a new ASIC is not always necessary. In many cases, suitable bare dies already exist
- How many dies fit on a wafer? And how do you quickly sketch that MEMS/IC cross-section without opening a heavy CAD tool? We had these questions often enough that we decided to build two small tools and make them available on the ZeptoNova website. The first one is a 𝗗𝗶𝗲 𝗽𝗲𝗿 𝗪𝗮𝗳𝗲𝗿 𝗖𝗮𝗹𝗰𝘂𝗹𝗮𝘁𝗼𝗿 & 𝗩𝗶𝘀𝘂𝗮𝗹𝗶𝘇𝗲𝗿, for quick die-count estimation and wafer-layout visualization. Useful for early cost estimation, wafer planning, and quick feasibility checks. The second one is 𝗖𝗿𝗼𝘀𝘀 𝗦𝗲𝗰𝘁𝗶𝗼𝗻 𝗖𝗔𝗗, a
- We are excited to be participating in the MUT 2026 Workshop and showcasing ZeptoNova at our exhibition booth. If you are attending the workshop, stop by and say hello! We'd be delighted to discuss your challenges and opportunities in MEMS, PiezoMEMS, ultrasound transducers, advanced packaging, and microfabrication. Whether you're developing the next generation of sensors, actuators, medical devices, photonics, or semiconductor technologies, we'd love to explore how ZeptoNova can support your journey from concept to product. We
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